3D IC Stacking Technology (BOK)

Banqiu Wu, Ajay Kumar, Sesh Ramaswami

1 049,00 1 04900
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The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Produktfakta

Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2011 Forfatter Ajay Kumar, Banqiu Wu, Sesh Ramaswami
Forlag
MCGRAW-HILL Professional
ISBN 9780071741958
Antall sider 544 Dimensjoner 16cm x 23,6cm x 2,3cm
Vekt 782 gram Leverandør Bertram Trading Ltd
Emner og form Circuits & components