Advanced Flip Chip Packaging (BOK)

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Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics. The flip chip packaging of today is drastically different from the technology of the 1990's. The demand for flip chip technology will continue to grow to meet the need for products that offer better performance, are smaller and are environmentally sustainable. "Advanced Flip Chip Packaging" presents past, present and future advances and trends in areas like substrate technology, material development and assembly processes.

Produktfakta

Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2010 Forlag
Springer
ISBN 9781441957672 Antall sider 500
Vekt 1092 gram Leverandør Bertram Trading Ltd
Andre medvirkende C. P. Wong, Ho-Ming Tong, Yi-Shao Lai Emner og form Electronics engineering, Circuits & components, Electronic devices & materials