Design And Modeling For 3d Ics And Interposers (BOK)

Madhavan Swaminathan

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Produktfakta

Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2013 Forfatter Madhavan Swaminathan
Forlag
World Scientific Publishing UK
ISBN 9789814508599
Antall sider 380 Dimensjoner 15,9cm x 23,5cm x 2,7cm
Vekt 673 gram Leverandør Bertram Trading Ltd