Microwave and Millimeter-Wave Electronic Packaging (BOK)

Rick Sturdivant

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Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.

Produktfakta

Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2014 Forfatter Rick Sturdivant
Forlag
Artech House Books
ISBN 9781608076970
Antall sider 282 Dimensjoner 16cm x 23,4cm x 2,2cm
Vekt 584 gram Leverandør Bertram Trading Ltd