Rapid Thermal Processing for Future Semiconductor Devices (BOK)

Fukuda

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This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices. This book covers the following areas such as: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

Produktfakta

Språk Engelsk Engelsk Innbinding Heftet
Utgitt 2003 Forfatter Fukuda
Forlag
BERTRAMS PRINT ON DEMAND
ISBN 9780444513397
Antall sider 160 Dimensjoner 16,7cm x 23,9cm x 0,8cm
Vekt 310 gram Leverandør Bertram Trading Ltd
Andre medvirkende Hisashi Fukuda