Reliability of RoHS-compliant 2D and 3D IC Interconnects (BOK)

John H. Lau

1 049,00 1 04900
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This title includes proven 2D and 3D IC lead-free interconnect reliability techniques. "Reliability of RoHS-Compliant 2D and 3D IC Interconnects" offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration.

Produktfakta

Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2000 Forfatter John H. Lau
Forlag
MCGRAW-HILL Professional
ISBN 9780071753791
Antall sider 640 Dimensjoner 16cm x 23,6cm x 2,6cm
Vekt 919 gram Leverandør Bertram Trading Ltd
Emner og form Electrical engineering, Circuits & components

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