Through-Silicon Vias for 3D Integration (BOK)

John H. Lau

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A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging


Språk Engelsk Engelsk Innbinding Innbundet
Utgitt 2012 Forfatter John H. Lau
MCGRAW-HILL Professional
ISBN 9780071785143
Antall sider 512 Dimensjoner 16cm x 23,6cm x 2,2cm
Vekt 725 gram Emner og form Electrical engineering

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